@article {Aoutoul2017125,
	title = {A novel interconnection technique using zero-degree phase shifting microstrip TL for RF QFN package at S-band},
	journal = {Progress in Electromagnetics Research Letters},
	volume = {67},
	year = {2017},
	note = {cited By 0},
	pages = {125-130},
	abstract = {In this paper, we propose a novel interconnection technique for a flip-chip quad flat no-lead (FC QFN) package which can decrease the amount of the transmission line (TL) phase shift. The RF die inputs and outputs (I/O) are connected to the package lead fingers by a small size, 1000 {\textmu}m length, microstrip line having a gap capacitor consisting of staked plates (fingers) where the space in between is filled by a ceramic material of 10.2 dielectric constant value. This technique can reduce the effect of transmission line inductance and makes the novel package interconnection behaving as a composite left right handed (CLRH) TL; hence, one can set the TL phase shift to zero degree at the desired operating frequency band (i.e., S-band) by just tuning geometrical and/or physical interconnection structure parameters. {\textcopyright} 2017, Electromagnetics Academy. All rights reserved.},
	doi = {10.2528/PIERL17031301},
	url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-85019546909\&doi=10.2528\%2fPIERL17031301\&partnerID=40\&md5=4be55e2571c969bc93a364b5554f37fc},
	author = {Aoutoul, M. and Haddad, A. and Essaaidi, M. and Faqir, M.}
}
